Modular Technology

QUESTION What does the term modular technology mean at ELMOS?

Putz Modular technology means that modules can be added to or omitted, according to need. Depending on the application profile, a high-volt function or flash cell for example can be integrated into the semiconductor chip.

QUESTION Which modules can be put together?

Putz All modules can be combined with one another. Due to the fact that ELMOS is focused primarily on the automotive industry, high-volt applications are virtually standard. The power-metal-function is commonly used with alternators as the chip is situated directly on the alternator and regulates the high currents. Another innovative product is the co-integrated pressure sensor, where the sensor component is integrated into the logic structure of the IC. This means the sensor module is fully integrated into the ASIC. Additionally, the package can also be individually configurated.

QUESTION What benefits for product development arise from this modular technology?

Putz There are two main advantages for product development. First of all, a modular structure means that the individual components are independent of each other. Adding to or omitting individual modules does not affect the modules which are to be used. The second advantage is that the use of identical modules allow comparisons between different pro-ducts to be made. Although the chips are custom-designed, we have had many years of experience in the individual mo-dules which enable us to optimize these chips even more and eliminate potential negative impacts in the module. In wafer production this means we have comparable parameters.

Using statistical quality controls, we can also analyze different chips on comparable levels. This makes it possible to have a long-term, consistent quality control.

QUESTION Why is using modular technology for semiconductors especially suited to the automotive industry?

Putz The automotive industry is characterized by its extremely high quality requirements. With our modular technology structure, each individual module is separately qualified enabling the final qualification of the whole product to be carried out more quickly. In addition, the chips we produce for the automotive industry are predominantly ASICs and therefore customer-specific.

For example, the requirements on an alternator ASIC and those on a window lifter differ enormously from one another. However both chips must comply with the high quality demands made on them. We provide therefore a high degree of flexibility combined with stable production conditions. The complete process flow is made transparent by both the qualification process and statistical quality controls. We are able to offer a consistently high level of quality which is ideally suited to the automotive field.

QUESTION What progress do you predict for the future?

Putz Our aim is to retain the modular technology structure in new processes too, such as in 0,35µ. Here it is essential that the components are compatible with the previous elements. In the next few years we can also expect much higher demands on software so that more importance will be attached to flash cells. A further development will be the increased combination of evaluation electronics and sensors. The challenge for us here with all these advances is to further develop our modular structure which in turn will enable us to maintain our quality controls and which moreover guarantees transparency for all process steps.